AJICURE
Applications
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Application as a curing acceleratorAjicure PN-23 and MY-24 have been proven to be extremely effective curing accelerators for epoxy/DICY or epoxy/organic acid anhydride systems. In comparison to curing accelerators incorporating aromatic tertiary amines or imidazole derivatives, which tend to deteriorate quickly, Ajicure PN-23 and MY-24 offer a much longer pot or shelf life. When either Ajicure PN-23 or MY-24 is incorporated into any of these latent systems as an accelerator in a range from 0.5 phr to 5 phr, the latency of the systems is not adversely affected, and stability is maintained for a month or more at temperatures as high as 40ºC. Yet systems can be cured at relatively lower temperatures in a short time: 100ºC/60 min. or 120ºC/30 min. Application as a curing agentAjicure PN-23 and MY-24 can be used either alone or mixed together as a latent curing agent for epoxy resins. When Ajicure PN-23 or MY-24 is formulated into epoxy resin (DGEBA) at a level of 20 phr, the result is a mixture with an unusually long pot life that remains stable for as long as a month or more, even at temperatures as high as 40ºC. Mixtures may also be cured at 80 - 120ºC for 30 - 60 min. to provide a high Tg and good mechanical properties.
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Final Application of One/Single Component Epoxy Adhesive
Red Glue for SMT Adhesive (Surface mount technology = Chip bonding)

Black Glue for COB adhesive (Chip On Board adhesive)

RELAY POTTING adhesive

Carbon Fiber Reinforced Plastic COMPOSITE / Prepreg

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